CHIP QUIK - No-Clean Lead-Free Solder Paste Jar, Sn96.5/Ag3/Cu0.5, T3 Mesh, 50g

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Product details

Product information

No-clean, lead-free solder paste in 50g jar.Printing speeds up to 100mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsPasses BONO test @ 1.56%Shelf life: >6 months (refrigerated), >2 months (unrefrigerated)Flux Type: Synthetic No CleanSolder Alloy: 96.5, 3, 0.5 Sn, Ag, CuMelting Temperature: 220°CWeight: 50g

Specifications

Brand	CHIP QUIK
Pack quantity	1
Product height	0.01mm
Product length	0.01mm
Product weight	65g
Product width	0.01mm
Product code	3341854182250