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CHIP QUIK Lead-Free Low Temperature Thermally Stable Solder Paste Jar 50g
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CHIP QUIK Lead-Free Low Temperature Thermally Stable Solder Paste Jar 50g
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Product information
No-clean, lead-free, low temperature thermally stable solder paste in 50g jar.Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate componentsPrinting speeds up to 125mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsAlloy: Sn42/Bi57.6/Ag0.4Flux Type: Synthetic No CleanSolder Alloy: 42, 57.6, 0.4 Sn, Bi, AgMelting Temperature: 138°CWeight: 50g
Specifications
| Brand | CHIP QUIK |
|---|---|
| Pack quantity | 1 |
| Product height | 0.01mm |
| Product length | 0.01mm |
| Product weight | 72g |
| Product width | 0.01mm |
| Product code | 3341854182298 |