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CHIP QUIK - Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4)
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CHIP QUIK - Solder Paste No Clean Sn96.5/Ag3.0/Cu0.5 2-Part Mix 15g (T4)
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Product information
No-Clean and Lead-FreeFlux Type: Synthetic No-CleanFlux Classification: REL0Metal Content: 87% Metal by weightParticle Size: T4 (20-38 microns)Two part mixFlux Type: No CleanSolder Alloy: 96.5, 3, 0.5 Sn, Ag, CuMelting Temperature: 217°CWeight: 15g
Specifications
| Brand | CHIP QUIK |
|---|---|
| Pack quantity | 1 |
| Product height | 0.01mm |
| Product length | 0.01mm |
| Product weight | 35g |
| Product width | 0.01mm |
| Product code | 3341854152222 |