CHIP QUIK - No-Clean, Lead-Free, Low Temperature, Solder Paste Syringe

No-clean, lead-free, low temperature thermally stable solder paste in syringe applicator with plunger and tip.Low melting point (138°) allows lower heat setting and reduces thermal damage to delicate componentsPrinting speeds up to 125mm/secLong stencil lifeWide process windowClear residueLow voidingExcellent wetting compatibility on most board finishesDispense gradeCompatible with enclosed print headsAlloy: Sn42/Bi57.6/Ag0.4Flux Type: Synthetic No CleanSolder Alloy: 42, 57.6, 0.4 Sn, Bi, AgMelting Temperature: 138°CWeight: 15g